Polishing Liquid, Lapping Oil & Slurry for Fiber Optic MPO/MTP Ferrule Polishing
XYT’s Polishing Liquids, Lapping Oils, and Slurries are formulated for high-precision fiber optic connector polishing, specifically optimized for MPO/MTP ferrules and multi-fiber connector systems. These consumables are used in combination with diamond films, oxide films, and flocked films to enhance surface quality, control polishing rates, and improve end-face geometry.
Whether you're performing bulk polishing, final geometry correction, or end-face defect elimination, our fluids ensure stable friction, effective debris removal, and minimal surface scratching, critical for maintaining insertion loss (IL) and return loss (RL) standards in high-performance fiber networks.
Abrasive Content: Colloidal Silicon Dioxide (SiO₂), Cerium Oxide (CeO₂), Silicon Carbide (Sic) or Aluminum Oxide (Al₂O₃)
Particle Size Options: 0.02μm, 0.05μm, 0.1μm, 0.3μm, 1μm, 3μm
pH Range: 9.5–10.5 (adjustable)
Viscosity: Low to medium
Application: Final polishing stage with SiO₂ or CeO₂ films
Benefits:
✅ Minimizes scratches
✅ Controls surface removal rate
✅ Ideal for APC and PC connectors
Formulation: Non-reactive synthetic oil with low viscosity
Compatibility: Diamond and Aluminum Oxide films
Color: Clear or light yellow
Application: Mid-stage polishing to reduce heat and increase tool life
Benefits:
✅ Reduces friction and heat buildup
✅ Improves diamond film life and surface quality
✅ Prevents galling and edge damage
Abrasive: Monocrystalline or polycrystalline diamond particles
Grit Size Range: 0.1μm – 3μm
Suspension Base: Water-soluble or oil-based
Application: Used with plain polishing pads or neutral films for custom setups
Benefits:
✅ Aggressive cut with precise control
✅ Used for specialty connectors or rework
MPO/MTP Ferrule Pre-polishing and Final Finishing
LC/SC/FC Connector End-Face Surface Prep
MT Ferrule Fiber Height and Geometry Control
APC (Angled Physical Contact) and PC Connector Polishing
Rework and Repair of Fiber Connectors
Precision-Engineered Formulas – Stable abrasive dispersion, optimized viscosity
️ Friction & Heat Control – Prevents connector tip deformation or thermal cracking
Excellent Wetting and Lubrication – Reduces polishing pressure while increasing finish uniformity
Low Contamination Risk – Cleanroom-compatible, minimal residue
⚙️ Compatible with Leading Polishing Machines – Domaille, Seikoh Giken, Senko, etc.
100ml, 500ml, 1L, 5L Bottles
Custom Labels & OEM Packaging Available
Batch Certification on Request (particle size & pH)
Trusted by leading fiber connector manufacturers worldwide
Compatible with all major polishing pads and films
Fast delivery with stable supply chain for large-scale production
Technical support for polishing process optimization
Matched polishing film kits (Diamond + Oxide + Slurry)
Rubber and glass pads for optimal pressure transfer
Free samples for lab testing or process evaluation