Silicon Dioxide Lapping Film

Overview

Silicon Dioxide Lapping Film (SiO₂ Lapping Film) is a highly specialized abrasive film designed for ultra-fine final polishing applications where surface cleanliness, minimal scratches, and excellent edge retention are critical. This film features uniformly dispersed nano-scale silica particles coated onto a flexible polyester film, offering superior surface quality and consistency.

Ideal for applications that demand a scratch-free finish at the nano-level, especially in fiber optics, semiconductor cross-sectioning, and high-precision optics.

Key Specifications

Abrasive Material: Amorphous Silicon Dioxide (SiO₂)
Backing: Optical-grade PET (Polyester Film)
Grit Sizes (Micron): 0.1μm, 0.02μm
Film Thickness: 75μm (±5%), customizable
Adhesive: With or without PSA (Pressure-Sensitive Adhesive)
Color: Typically white or light gray
Format: Sheets, discs, rolls, or custom-cut sizes (1mm–350mm)

Applications

Silicon Dioxide Lapping Film is engineered for final step polishing where ultra-flatness and surface integrity are essential:

Fiber Optic Ferrule Final Polish (LC, SC, MPO, MTP)
MT Connector End-Face Final Polishing
Semiconductor Cross-Section Preparation
Glass Substrates & Optical Lenses
Hard Disk Media and Magnetic Heads
High-Precision Ceramic Surface Finishing

Performance Features

Extremely Fine Finishing: Achieves sub-nanometer Ra roughness
Scratch-Free Polish: Prevents micro-scratches on sensitive surfaces
Excellent Edge Retention: Maintains geometry of fiber end-faces and IC structures
High Cleanliness: Ideal for inspection-ready surfaces
Uniform Abrasive Coating: Stable and consistent finish across large surfaces

Polishing Process Example

Fiber Optic Final Polishing Sequence:

3μm Diamond Film →
1μm Diamond Film →
0.3μm Diamond Film →
0.1μm or 0.02μm SiO₂ Film (Final finishing)

Semiconductor Cross-Sectioning:

Use 0.1μm or 0.02μm SiO₂ film as the final polishing step after removing bulk material with diamond films. This ensures sharp, clean edges for 10–20nm feature analysis under SEM or TEM.

When to Use Silicon Dioxide Film

Requirement	Use SiO₂ Film?
Final nanometer-level polish	✅ Yes
Eliminate fine scratches	✅ Yes
Epoxy or bulk material removal	❌ No
High removal rate needed	❌ No
Optical inspection preparation	✅ Yes

Common Use Problems & Solutions

Issue	Cause	Solution
Surface haze or swirl marks	Film contamination	Clean surface; use fresh SiO₂ film
Micro-scratches on final polish	Skipped grit steps	Add intermediate diamond step (0.3μm)
Poor edge retention	Worn or overloaded film	Replace with new SiO₂ film
Film slippage	Improper PSA adhesion	Ensure clean, flat platen surface

Why Choose XYT Silicon Dioxide Lapping Film

Manufactured under cleanroom conditions for optical-grade use
Superior edge retention and anti-scratch performance
0.02μm nano-polishing grade available for SEM/TEM sample prep
Compatible with fiber optic polishing fixtures, cross-section machines
Custom formats, die-cut sizes, and OEM/private label services available
Large inventory with fast delivery worldwide