Product Parameter
| Abrasive Material |
Application Highlights |
| Diamond |
Hard materials (ceramics, glass, fiber optic connectors, carbide) |
| Aluminum Oxide (Alumina) |
General-purpose, suitable for soft metals and plastics |
| Silicon Carbide (SiC) |
Harder than alumina; ideal for glass, ceramics, and composite materials |
| Cerium Oxide |
Final polishing of glass and optical surfaces |
| Silicon Dioxide (Silica) |
Ultrafine finishing; excellent for epoxy and soft material removal |
Product Description & Introduction
Lapping films are essential tools in the precision polishing industry, particularly for applications demanding high surface finishes such as fiber optic connectors, ceramics, and various optical components. Our range includes diamond, aluminum oxide, silicon carbide, cerium oxide, and silica films tailored to meet the diverse needs of different materials and finishing requirements.
With options such as diamond lapping film, designed for the most challenging materials like ceramics and hard metals, and alumina films for softer metals and plastics, our products promise exceptional performance. Each type of film is engineered to provide precise results, ensuring optimal surface finish and clarity.
Key Features:
- Wide variety for specific applications: From fiber optics to medical devices.
- Multiple grit options for gradual polishing: Ensuring smooth transitions and finishes.
- Durable and effective: High-quality materials for long-lasting performance.
Applications:
- Fiber Optic Connector Polishing (LC, SC, FC, MPO/MTP)
- Glass Lens & Optical Component Finishing
- Ceramic Ferrule Polishing
- Metal Mold & Tool Surface Preparation
- Semiconductor Wafer & Chip Packaging
- Medical Device Surface Polishing
Polishing Process Steps:
- Step 1 – Coarse Lapping: Using 30 µm / 15 µm to remove surface irregularities and epoxy.
- Step 2 – Intermediate Polish: 9 µm / 6 µm / 3 µm for refining surfaces and reducing scratches.
- Step 3 – Final Polish: Achieve optical clarity with 1 µm / 0.5 µm / 0.3 µm films.
- Step 4 – Cleaning: Optional cleaning or buffing for perfection.
Incorporating these lapping films into your polishing process will enhance your production quality, reduce defects, and maximize yield for all applications from fiber optics to semiconductor packaging. Trust XYT to provide you with reliable polishing solutions that meet the highest industry standards.